Hong Kong Institute of Bankers ECF FinTech Agreement Signing Ceremony on 2022 June 22

Hong Kong Institute of Bankers ECF FinTech Agreement Signing Ceremony on 2022 June 22

DBAAA Members are invited and participated in the development of teaching materials and teaching in The Hong Kong Institute of Bankers (HKIB) Enhanced Competence Framework (ECF) FinTech.  At the Signing Ceremony on 22 June, 2022 are Dr. Derek Ching, Dr. Michael Wu, Tony Yip and Brian Kei of DBAAA, and Prof. Wilson Tong, Prof. Xu Xin and Prof. Steven Wei of FB.